TY - JOUR
T1 - Viscoelastic properties of reconstituted cassava dough
AU - Rodríguez-Sandoval, Eduardo
AU - Fernández-Quintero, Alejandro
AU - Sandoval-Aldana, Angélica
AU - Cuvelier, Gerard
AU - Bello-Peréz, Luis A.
PY - 2009/1
Y1 - 2009/1
N2 - The influence of water (60-70%) and salt (1-2%) content on the viscoelastic properties of cassava dough, reconstituted from cooked flour, was studied using a controlled strain rheometer. Reconstituted cassava dough behaved as a solid-like material with the storage modulus (G′) predominant over the loss modulus (G″). As the water content was increased, G′ decreased and G″ increased; but tan D was practically independent of the water content. This behaviour suggested that water had plasticising effects, but probably did not change dough structure. The effect of salt content on the dynamic rheological properties of cassava dough was not significant, except for G″ values at water contents close to 60%.
AB - The influence of water (60-70%) and salt (1-2%) content on the viscoelastic properties of cassava dough, reconstituted from cooked flour, was studied using a controlled strain rheometer. Reconstituted cassava dough behaved as a solid-like material with the storage modulus (G′) predominant over the loss modulus (G″). As the water content was increased, G′ decreased and G″ increased; but tan D was practically independent of the water content. This behaviour suggested that water had plasticising effects, but probably did not change dough structure. The effect of salt content on the dynamic rheological properties of cassava dough was not significant, except for G″ values at water contents close to 60%.
KW - Cassava dough
KW - Flour
KW - Rheology
KW - Viscoelastic properties
UR - http://www.scopus.com/inward/record.url?scp=57649118570&partnerID=8YFLogxK
U2 - 10.1111/j.1365-2621.2007.01695.x
DO - 10.1111/j.1365-2621.2007.01695.x
M3 - Artículo
SN - 0950-5423
VL - 44
SP - 138
EP - 144
JO - International Journal of Food Science and Technology
JF - International Journal of Food Science and Technology
IS - 1
ER -