Preparation of aluminum nitride thin films by CVD

Reynaldo Martínez Guerrero, J. Roberto Vargas García

Producción científica: Contribución a una revistaArtículorevisión exhaustiva

6 Citas (Scopus)

Resumen

AlN films were prepared by CVD using aluminum halide (AlCl3) and aluminum alkyl ((CH3)3Al) precursors. The appropriate deposition conditions to obtain polycrystalline AlN films using AlCl3 precursor were found at Tdep = 1173 K, Ptot = 66.6 Pa and N2/NH3 = 0.75. It was found that AlN films of different crystallinity can be obtained from (CH3)3Al precursor at Tdep = 973-1023 K, Ptot = 1.99 kPa, only under a H2 atmosphere. AlN films can be grown highly oriented in the (210) direction on amorphous quartz substrates depending on their thicknesses. The 0.1-0.2 μm thick AlN films were transparent and their refractive indexes were about 1.4-1.6.

Idioma originalInglés
Páginas (desde-hasta)259-267
Número de páginas9
PublicaciónMaterials and Manufacturing Processes
Volumen15
N.º2
DOI
EstadoPublicada - 2000

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