Differences in the laser annealing of a-Si:H and a-SiC films

B. García, M. Estrada, F. Cruz-Gandarilla, M. N.P. Carreño, I. Pereyra

Producción científica: Contribución a una revistaArtículo de la conferenciarevisión exhaustiva

8 Citas (Scopus)

Resumen

In this paper we compare differences in particle size, surface roughness, resistivity and X-ray Diffraction pattern observed in a-Si:C and a-Si 0.5 C 0.5 layers crystallized by excimer (KrF) laser annealing (ELA), under similar conditions. The characteristics of the crystallized films are interpreted considering the difference in melting temperature and thermal coefficient of both materials. Looking toward reducing surface roughness, a comparison of poly-Si layer characteristics, when ELA is done directly and through a SiO 2 layer, is also shown.

Idioma originalInglés
Páginas (desde-hasta)164-167
Número de páginas4
PublicaciónProceedings of the IEEE International Caracas Conference on Devices, Circuits and Systems, ICCDCS
EstadoPublicada - 2004
Evento5th IEEE International Caracas Conference on Devices, Circuits and Systems, ICCDCS - , República Dominicana
Duración: 3 nov. 20045 nov. 2004

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