TY - GEN
T1 - 4H-SiC PiN diode electrothermal model for conduction and reverse breakdown for Pspice simulator
AU - Hernandez, L.
AU - Claudio-Sánchez, A.
AU - Cotorogea, M.
AU - Aguayo, J.
AU - Rodríguez, M. A.
PY - 2008
Y1 - 2008
N2 - Recently, interest in the use of the 4H-SiC material for the manufacture of power devices has increased. The PiN diode is one of the silicon carbide power devices more promising for its application in power converters systems. This has motivated the development of a model that allows describing the 4H-SiC PiN diode behavior correctly. In this paper the simulation results obtained by the implementation of a physical model of the PiN diode in 4H-SiC using Pspice are presented. The model describes the dependency on the temperature for the steady-state condition as well as the breakdown voltage. In order to obtain a suitable description of the main physical phenomena associated to silicon carbide, analytical expressions dependent on temperature, were analyzed and incorporated to the model. The Pspice-implemented model allows describing the behavior of a 4H-SiC PiN diode in forward conduction and reverse breakdown without convergence problems during its simulation.
AB - Recently, interest in the use of the 4H-SiC material for the manufacture of power devices has increased. The PiN diode is one of the silicon carbide power devices more promising for its application in power converters systems. This has motivated the development of a model that allows describing the 4H-SiC PiN diode behavior correctly. In this paper the simulation results obtained by the implementation of a physical model of the PiN diode in 4H-SiC using Pspice are presented. The model describes the dependency on the temperature for the steady-state condition as well as the breakdown voltage. In order to obtain a suitable description of the main physical phenomena associated to silicon carbide, analytical expressions dependent on temperature, were analyzed and incorporated to the model. The Pspice-implemented model allows describing the behavior of a 4H-SiC PiN diode in forward conduction and reverse breakdown without convergence problems during its simulation.
UR - http://www.scopus.com/inward/record.url?scp=56649105370&partnerID=8YFLogxK
U2 - 10.1109/CIEP.2008.4653842
DO - 10.1109/CIEP.2008.4653842
M3 - Contribución a la conferencia
AN - SCOPUS:56649105370
SN - 9781424427185
T3 - International Power Electronics Congress - CIEP
SP - 192
EP - 197
BT - Proceedings of the 11th IEEE International Conference on Power Electronics Congress, CIEP 2008
T2 - 11th IEEE International Conference on Power Electronics Congress, CIEP 2008
Y2 - 24 August 2008 through 27 August 2008
ER -