Strain dependence of indirect band gap for strained silicon on insulator wafers

J. Munguía, G. Bremond, J. M. Bluet, J. M. Hartmann, M. Mermoux

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Abstract

We have used low temperature photoluminescence measurements in order to quantify the impact of strain effect on the Si indirect band gap in 9 nm thick tensely strained silicon on insulator layers. A redshift of the transverse optical phonon excitonic recombination in the strained silicon layer was evidenced as the strain in the layer is increased. Band gap shrinkages in the Δ direction equal to 130±3 meV, 184±3 meV, and 239±3 meV were obtained for 0.87±0.03%, 1.22±0.05%, and 1.54±0.06% strain values. These measured indirect transitions are in good agreement with the calculated strained silicon indirect band gap values.

Original languageEnglish
Article number102101
JournalApplied Physics Letters
Volume93
Issue number10
DOIs
StatePublished - 2008
Externally publishedYes

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