Optimum use of high-impedance surface in PCB to mitigate the simultaneous switching noise and radiated emission

R. Peña-Rivero; H. Jardón Aguilar; R. Linares y Miranda

doi:10.1002/mop.21632

Optimum use of high-impedance surface in PCB to mitigate the simultaneous switching noise and radiated emission

R. Peña-Rivero, H. Jardón Aguilar, R. Linares y Miranda

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Optimum use of high-impedance surfaces (HIS) in high-speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply bus, creating a rejection over the bandwidth frequency of interest. The effective method in two-layer PCBs with two rows (3-mm each) of square pads is implemented with a 0.5-mm separation between the power-supply bus, in the 8-12-GHz frequency range, obtaining 20-dB rejection and 15-dB less radiated emission.

Original language	English
Pages (from-to)	1446-1449
Number of pages	4
Journal	Microwave and Optical Technology Letters
Volume	48
Issue number	7
DOIs	https://doi.org/10.1002/mop.21632
State	Published - Jul 2006
Externally published	Yes

Keywords

High-impedance surface
High-speed digital signal
Printed circuit board
Radiated emission
Simultaneous switching noise

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10.1002/mop.21632

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title = "Optimum use of high-impedance surface in PCB to mitigate the simultaneous switching noise and radiated emission",

abstract = "Optimum use of high-impedance surfaces (HIS) in high-speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply bus, creating a rejection over the bandwidth frequency of interest. The effective method in two-layer PCBs with two rows (3-mm each) of square pads is implemented with a 0.5-mm separation between the power-supply bus, in the 8-12-GHz frequency range, obtaining 20-dB rejection and 15-dB less radiated emission.",

keywords = "High-impedance surface, High-speed digital signal, Printed circuit board, Radiated emission, Simultaneous switching noise",

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year = "2006",

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T1 - Optimum use of high-impedance surface in PCB to mitigate the simultaneous switching noise and radiated emission

AU - Peña-Rivero, R.

AU - Aguilar, H. Jardón

AU - Linares y Miranda, R.

PY - 2006/7

Y1 - 2006/7

N2 - Optimum use of high-impedance surfaces (HIS) in high-speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply bus, creating a rejection over the bandwidth frequency of interest. The effective method in two-layer PCBs with two rows (3-mm each) of square pads is implemented with a 0.5-mm separation between the power-supply bus, in the 8-12-GHz frequency range, obtaining 20-dB rejection and 15-dB less radiated emission.

AB - Optimum use of high-impedance surfaces (HIS) in high-speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply bus, creating a rejection over the bandwidth frequency of interest. The effective method in two-layer PCBs with two rows (3-mm each) of square pads is implemented with a 0.5-mm separation between the power-supply bus, in the 8-12-GHz frequency range, obtaining 20-dB rejection and 15-dB less radiated emission.

KW - High-impedance surface

KW - High-speed digital signal

KW - Printed circuit board

KW - Radiated emission

KW - Simultaneous switching noise

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DO - 10.1002/mop.21632

M3 - Artículo

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EP - 1449

JO - Microwave and Optical Technology Letters

JF - Microwave and Optical Technology Letters

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ER -

Optimum use of high-impedance surface in PCB to mitigate the simultaneous switching noise and radiated emission

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Keywords

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