Nitrogen incorporation in Al2O3 thin films prepared by pulsed ultrasonic sprayed pyrolysis

S. Carmona-Tellez, C. Palacio, S. Gallardo, Z. Rivera, M. Aguilar-Frutis, M. Garcia-Hipolito, G. Alarcon-Flores, C. Falcony

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

The electrical characteristics and the chemical composition profiles determined by XPS and SIMS for aluminum oxide thin films deposited by pulsed ultrasonic spray pyrolysis are reported. The films were deposited on c-Si at 550 °C using a chemical solution of aluminum acetylacetonate as source of aluminum and N, N-Dimethylformamide as solvent, in addition a H 2O-NH4OH mist was supplied simultaneously during deposition to improve the overall properties of these films. The results show that there is nitrogen incorporation in the films at the interface with the Si substrate. There is also a clear migration of silicon into the deposited film. The thickness of the films was in the range of 30 nm. Infrared spectroscopy also shows the presence of Si-O bonds. The dielectric constant for these films was higher than 8 and their interface trap density at midgap was in the 10 10 eV-1 cm-2 range.

Original languageEnglish
Title of host publicationECS Transactions - Physics and Technology of High-k Gate Dielectrics 7
PublisherElectrochemical Society Inc.
Pages179-186
Number of pages8
Edition6
ISBN (Electronic)9781607680932
ISBN (Print)9781566777438
DOIs
StatePublished - 2009
Externally publishedYes
Event7th International Symposium on High Dielectric Constant Materials and Gate Stacks - 216th Meeting of the Electrochemical Society - Vienna, Austria
Duration: 5 Oct 20097 Oct 2009

Publication series

NameECS Transactions
Number6
Volume25
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference7th International Symposium on High Dielectric Constant Materials and Gate Stacks - 216th Meeting of the Electrochemical Society
Country/TerritoryAustria
CityVienna
Period5/10/097/10/09

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