Hermetic capacitive pressure sensors for biomedical applications

Daniela Diaz-Alonso, Mario Moreno-Moreno, Carlos Zuñiga, Joel Molina, Wilfrido Calleja, Juan Carlos Cisneros, Luis Niño De Rivera, Volodymir Ponomaryov, Felix Gil, Angel Guillen, Efrain Rubio

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Purpose-This paper aims to purpose the new design and fabrication scheme of Touch Mode Capacitive Pressure Sensor (TMCPS), which can be used in a wireless integrated resistor, inductor and capacitor circuit for monitoring pressure in biomedical applications. Design/methodology/approach-This study focuses on the design, simulation and fabrication of dynamic capacitors, based on surface micromachining using polysilicon or aluminum films as the top electrode, both structural materials are capped with a 1.5m-thick polyimide film. Findings-The design of microstructures using a composite model fits perfectly the preset mechanical behavior. After the full fabrication, the dynamic capacitors show complete mechanical flexibility and stability. Originality/value-The novelty of the method presented in this study includes two important aspects: first, the capacitors are designed as a planar cavity within a rigid frame, where two walls contain channels which allow for the etching of the sacrificial material. Second, the electromechanical structures are designed using a composite model that includes a polyimide film capping for a precise pressure sensing, which also protects the internal cavity and, at the same time, provides full biocompatibility.

Original languageEnglish
Pages (from-to)79-86
Number of pages8
JournalMicroelectronics International
Volume33
Issue number2
DOIs
StatePublished - 2016

Keywords

  • Biomedical sensors
  • Polyimide films
  • Pressure sensors
  • Surface micromachining
  • Touch-Mode capacitive devices

Fingerprint

Dive into the research topics of 'Hermetic capacitive pressure sensors for biomedical applications'. Together they form a unique fingerprint.

Cite this