Geostatistical analysis of fall armyworm damage and edaphoclimatic conditions of a mosaic of agroecosystems predominated by push-pull systems

Ouorou Ganni Mariel Guera, Federico Castrejón-Ayala, Norma Robledo, Alfredo Jiménez Pérez, Van Huong Le, Martín Alberto Díaz-Viera, José Antônio Aleixo da Silva

Research output: Contribution to journalArticlepeer-review

Abstract

Some agroecological pest management systems manipulate insect behavior. The push-pull systems are the most functional implemented, reducing the insect-pest density and modifying its distribution. The present work analyzed the spatial distribution of incidence and severity of fall armyworm (FAW) (Spodoptera frugiperda (J.E. Smith), Lepidoptera: Noctuidae), and soil moisture and temperature in maize (Zea mays L.) crops of a mosaic of agroecosystems predominated by push-pull systems established in Yautepec, Morelos, Mexico. Univariate and multivariate spatial estimates were performed by geostatistical analysis applying ordinary kriging and cokriging, respectively. The results indicated that FAW incidence and severity presented an aggregated spatial distribution and soil moisture and temperature, a more continuous distribution. The estimated spatial distributions in the third week indicated that FAW incidence in push-pull systems varied between 10% and 40%, and in maize monocultures, between 35% and 90%. Fall armyworm damage severity ranged between 20% and 70% in monocultures and between 1% and 25% in the push-pull systems.

Original languageEnglish
Pages (from-to)14-30
Number of pages17
JournalChilean Journal of Agricultural Research
Volume83
Issue number1
DOIs
StatePublished - Feb 2023

Keywords

  • Cokriging
  • Spodoptera frugiperda
  • fall armyworm incidence and severity
  • kriging
  • soil temperature and moisture

Fingerprint

Dive into the research topics of 'Geostatistical analysis of fall armyworm damage and edaphoclimatic conditions of a mosaic of agroecosystems predominated by push-pull systems'. Together they form a unique fingerprint.

Cite this