TY - GEN
T1 - Electric Field and Heat at the CAT-SG Coatings Interface under Fast Rise Pulses
AU - Ramirez-Serrano, J. C.
AU - Espino-Cortes, F. P.
AU - Hernandez-Ramirez, E. J.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/10/3
Y1 - 2018/10/3
N2 - PWM voltages modify the performance of the stress grading coatings at the end winding region of rotating machines. The electric field and heat in these layers become intensified under this type of waveforms. Under this condition, the design of the stress grading and the conductive armor coatings can become difficult and modeling has resulted in a useful tool in understanding the influence of the various design parameters. In this work, optical micrographs of the overlapping area are obtained from form-wound coils to observe the topology of the interface between conductive armor and stress grading tapes. The interface geometries observed in the images are used to simulate the electric field and heat under fast rise time pulses, and the results are compared with those obtained with the typical interface topology used in simulations.
AB - PWM voltages modify the performance of the stress grading coatings at the end winding region of rotating machines. The electric field and heat in these layers become intensified under this type of waveforms. Under this condition, the design of the stress grading and the conductive armor coatings can become difficult and modeling has resulted in a useful tool in understanding the influence of the various design parameters. In this work, optical micrographs of the overlapping area are obtained from form-wound coils to observe the topology of the interface between conductive armor and stress grading tapes. The interface geometries observed in the images are used to simulate the electric field and heat under fast rise time pulses, and the results are compared with those obtained with the typical interface topology used in simulations.
KW - Pulse width modulation
KW - conductive armor tape
KW - fast rise time pulses
KW - interface topology
KW - stress grading tape
UR - http://www.scopus.com/inward/record.url?scp=85056283085&partnerID=8YFLogxK
U2 - 10.1109/EIC.2018.8481045
DO - 10.1109/EIC.2018.8481045
M3 - Contribución a la conferencia
AN - SCOPUS:85056283085
T3 - 2018 IEEE Electrical Insulation Conference, EIC 2018
SP - 158
EP - 161
BT - 2018 IEEE Electrical Insulation Conference, EIC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE Electrical Insulation Conference, EIC 2018
Y2 - 17 June 2018 through 20 June 2018
ER -