Effect of Thermal Annealing up to 200°C on SnO Thin Films Deposited at Room Temperature by Direct Current Magnetron Sputtering

Samuel Martinez-Arreola, Salvador I. Garduno, Norberto Hernandez-Como, Magali Estrada

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The effect of thermal annealing at low temperature (≤200°C) on some structural, optical, and electrical properties of tin (Sn) layers, deposited at room temperature by direct current magnetron sputtering in an argon and oxygen reactive plasma, was studied to obtain tin monoxide (SnO). The Sn layers were 70±5 nm thick. The oxygen partial pressure (OPP) was fixed at 7% or 9%. Subsequently, deposited films were thermally annealed (TA) for 1 hour at temperatures between 160° C and 200° C in air environment. X-ray diffraction patterns of films deposited at 7% and 9% of OPP showed a dominant Sn phase oriented to different crystallographic planes. Once the deposited films were annealed at 200° C, a phase of polycrystalline SnO became predominant for the deposition process at 9% of OPP. The optical bandgap energy, the refractive index and the extinction coefficient of the annealed layers varied with the TA temperature. Finally, four-point-probe measurements showed the resistivity variation of the films from as-deposited to thermally annealed up to 200° C.

Original languageEnglish
Title of host publicationLAEDC 2020 - Latin American Electron Devices Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728110448
DOIs
StatePublished - Feb 2020
Event2020 Latin American Electron Devices Conference, LAEDC 2020 - San Jose, Costa Rica
Duration: 25 Feb 202028 Feb 2020

Publication series

NameLAEDC 2020 - Latin American Electron Devices Conference

Conference

Conference2020 Latin American Electron Devices Conference, LAEDC 2020
Country/TerritoryCosta Rica
CitySan Jose
Period25/02/2028/02/20

Keywords

  • lowerature annealing process
  • p-type metal oxide semiconductor
  • reactive DC-magnetron sputtering
  • tin monoxide

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