TY - JOUR
T1 - Transient thermomechanical simulation of 7075 aluminum contraction around a SiO2 microparticle pedro
AU - Tamayo-Meza, Alejandro
AU - Cerro-Ramírez, Miguel Ángel
AU - Merchán-Cruz, Emmanuel Alejandro
AU - Silva-Rivera, Usiel Sandino
AU - Rivera-Blas, Raúl
AU - Flores-Herrera, Luis Armando
N1 - Publisher Copyright:
© 2020 by the authors. Licensee MDPI, Basel, Switzerland.
PY - 2021/1
Y1 - 2021/1
N2 - One important challenge that faces the metallurgic industry turns around the constant increment in the mechanical resistance of certain finished products. Metallurgic advantages can be obtained from the inclusion of microparticles in metallic materials, but this inclusion involves complex challenges as the internal stress distribution can be modified. In this work, the simulation of a cooling sequence in 7075 aluminum with a SiO microparticle is presented. Two models of twodimensional (2D) type were constructed in ANSYS®2019 with circular and oval shape microparticles located inside the aluminum. Both models were subjected to the same thermomechanical transient analysis to compare the remaining stress distributions around the microparticles after the thermal load and to observe the effect of the geometrical shape. The results show remaining stresses increased in the oval model as a consequence of the geometrical shape modification. After applying a tension load in the analyzed specimens, shear stress concentrations were observed with a higher magnitude around the covertex of the oval shape. The results can be very useful for the creation of materials with controlled remnant stress located in specific or desired locations in the matrix.
AB - One important challenge that faces the metallurgic industry turns around the constant increment in the mechanical resistance of certain finished products. Metallurgic advantages can be obtained from the inclusion of microparticles in metallic materials, but this inclusion involves complex challenges as the internal stress distribution can be modified. In this work, the simulation of a cooling sequence in 7075 aluminum with a SiO microparticle is presented. Two models of twodimensional (2D) type were constructed in ANSYS®2019 with circular and oval shape microparticles located inside the aluminum. Both models were subjected to the same thermomechanical transient analysis to compare the remaining stress distributions around the microparticles after the thermal load and to observe the effect of the geometrical shape. The results show remaining stresses increased in the oval model as a consequence of the geometrical shape modification. After applying a tension load in the analyzed specimens, shear stress concentrations were observed with a higher magnitude around the covertex of the oval shape. The results can be very useful for the creation of materials with controlled remnant stress located in specific or desired locations in the matrix.
KW - Microparticle
KW - Plate defects
KW - Simultaneous cooling
KW - Stress state
UR - http://www.scopus.com/inward/record.url?scp=85098759443&partnerID=8YFLogxK
U2 - 10.3390/ma14010134
DO - 10.3390/ma14010134
M3 - Artículo
C2 - 33396874
AN - SCOPUS:85098759443
SN - 1996-1944
VL - 14
SP - 1
EP - 11
JO - Materials
JF - Materials
IS - 1
M1 - 134
ER -