TY - JOUR
T1 - Stress grading materials for cable terminations under fast rise time pulses
AU - Espino-Cortes, F. P.
AU - Jayaram, S.
AU - Cherney, E. A.
N1 - Funding Information:
ACKNOWLEDGMENTS The authors would like to express their appreciation to the financial support provided by NSERC of Canada. F. P.E.C. is on study leave from the National Polytechnic Institute in Mexico City, he also gratefully acknowledges CONACyT-Mexico for financially supporting his graduate studies. REFERENCES
PY - 2006/4
Y1 - 2006/4
N2 - The paper discusses the material properties and designs of stress grading coatings for cable terminations that can help to reduce the adverse effects of stepped voltages present in voltage source converters. Simulations using transient and quasistatic finite element method, as well as experimental measurements of stress grading materials are presented in this study. The use of two stress grading layers in cable terminations is suggested as an alternative design to reduce the hot spot temperature in conductive stress grading coatings.
AB - The paper discusses the material properties and designs of stress grading coatings for cable terminations that can help to reduce the adverse effects of stepped voltages present in voltage source converters. Simulations using transient and quasistatic finite element method, as well as experimental measurements of stress grading materials are presented in this study. The use of two stress grading layers in cable terminations is suggested as an alternative design to reduce the hot spot temperature in conductive stress grading coatings.
KW - Cable termination
KW - Fast rise time pulses
KW - Field dependent conductivity
KW - PWM-VSC
KW - Semiconductive screen
KW - Stress grading coating
KW - Varistor material
UR - http://www.scopus.com/inward/record.url?scp=33646435115&partnerID=8YFLogxK
U2 - 10.1109/TDEI.2006.1624289
DO - 10.1109/TDEI.2006.1624289
M3 - Artículo
SN - 1070-9878
VL - 13
SP - 430
EP - 435
JO - IEEE Transactions on Dielectrics and Electrical Insulation
JF - IEEE Transactions on Dielectrics and Electrical Insulation
IS - 2
ER -