Stress grading materials for cable terminations under fast rise time pulses

F. P. Espino-Cortes, S. Jayaram, E. A. Cherney

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

The paper discusses the material properties and designs of stress grading coatings for cable terminations that can help to reduce the adverse effects of stepped voltages present in voltage source converters. Simulations using transient and quasistatic finite element method, as well as experimental measurements of stress grading materials are presented in this study. The use of two stress grading layers in cable terminations is suggested as an alternative design to reduce the hot spot temperature in conductive stress grading coatings. © 2006 IEEE.
Original languageAmerican English
Pages (from-to)430-435
Number of pages386
JournalIEEE Transactions on Dielectrics and Electrical Insulation
DOIs
StatePublished - 1 Apr 2006
Externally publishedYes

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Electric connectors
Hot Temperature
Coatings
Electric potential
Materials properties
Finite element method
Temperature

Cite this

@article{d34ce7c199c74c8298651e97798708cb,
title = "Stress grading materials for cable terminations under fast rise time pulses",
abstract = "The paper discusses the material properties and designs of stress grading coatings for cable terminations that can help to reduce the adverse effects of stepped voltages present in voltage source converters. Simulations using transient and quasistatic finite element method, as well as experimental measurements of stress grading materials are presented in this study. The use of two stress grading layers in cable terminations is suggested as an alternative design to reduce the hot spot temperature in conductive stress grading coatings. {\circledC} 2006 IEEE.",
author = "Espino-Cortes, {F. P.} and S. Jayaram and Cherney, {E. A.}",
year = "2006",
month = "4",
day = "1",
doi = "10.1109/TDEI.2006.1624289",
language = "American English",
pages = "430--435",
journal = "IEEE Transactions on Dielectrics and Electrical Insulation",
issn = "1070-9878",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

Stress grading materials for cable terminations under fast rise time pulses. / Espino-Cortes, F. P.; Jayaram, S.; Cherney, E. A.

In: IEEE Transactions on Dielectrics and Electrical Insulation, 01.04.2006, p. 430-435.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Stress grading materials for cable terminations under fast rise time pulses

AU - Espino-Cortes, F. P.

AU - Jayaram, S.

AU - Cherney, E. A.

PY - 2006/4/1

Y1 - 2006/4/1

N2 - The paper discusses the material properties and designs of stress grading coatings for cable terminations that can help to reduce the adverse effects of stepped voltages present in voltage source converters. Simulations using transient and quasistatic finite element method, as well as experimental measurements of stress grading materials are presented in this study. The use of two stress grading layers in cable terminations is suggested as an alternative design to reduce the hot spot temperature in conductive stress grading coatings. © 2006 IEEE.

AB - The paper discusses the material properties and designs of stress grading coatings for cable terminations that can help to reduce the adverse effects of stepped voltages present in voltage source converters. Simulations using transient and quasistatic finite element method, as well as experimental measurements of stress grading materials are presented in this study. The use of two stress grading layers in cable terminations is suggested as an alternative design to reduce the hot spot temperature in conductive stress grading coatings. © 2006 IEEE.

UR - https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=33646435115&origin=inward

UR - https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=33646435115&origin=inward

U2 - 10.1109/TDEI.2006.1624289

DO - 10.1109/TDEI.2006.1624289

M3 - Article

SP - 430

EP - 435

JO - IEEE Transactions on Dielectrics and Electrical Insulation

JF - IEEE Transactions on Dielectrics and Electrical Insulation

SN - 1070-9878

ER -