Roughness characterisation of gas phase micromachining process suitable for fabricating silicon based microsystems

Muthukumaran Packirisamy, I. Stiharu, L. Flores

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Non-conventional or advanced machining techniques are becoming the enabling fabrication techniques for many emerging fields including Micro Electro Mechanical Systems (MEMS) or Microsystems Technology (MST). The processes used for MEMS fabrication include standard semiconductor fabrication processes and emerging micromachining techniques. Among the challenges emerging from the manufacturing of MEMS devices, post-processing seems to be one of the most sensitive issues. The non-traditional common post-processing techniques are bulk micromachining and surface micromachining. It has been a challenge for MEMS designers to develop a micromachining technique that is compatible with IC (Integrated Circuits) processes and also capable of making MEMS structures through both bulk and surface micromachining with acceptable surface roughness requirements. The selected micromachining process should not affect the integrity of the free standing structure due to the reduced selectivity and aggressive etch of the adjacent electronic circuitry. Moreover, the integrity of the released structure, the dynamic properties as well as the electrostatic characteristics, are strongly dependent on the achieved roughness of the surfaces produced by the etching process. Hence, this paper presents the surface roughness characterisation of gas phase micromachining with XeF2that is suitable for fabricating integrated MEMS with both micromechanical and microelectronics components. This paper also presents some fabricated microsystems using this process. Copyright © 2005 Inderscience Enterprises Ltd.
Original languageAmerican English
Pages (from-to)224-245
Number of pages199
JournalInternational Journal of Manufacturing Technology and Management
DOIs
StatePublished - 15 Jun 2005
Externally publishedYes

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Microtechnology
Micro-Electrical-Mechanical Systems
Microsystems
Micromachining
Silicon
Gases
Surface roughness
Surface micromachining
Fabrication
Post and Core Technique
Processing
Microelectronics
Integrated circuits
Semiconductors
Electrostatics
Etching
Machining
Roughness
Gas
Static Electricity

Cite this

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abstract = "Non-conventional or advanced machining techniques are becoming the enabling fabrication techniques for many emerging fields including Micro Electro Mechanical Systems (MEMS) or Microsystems Technology (MST). The processes used for MEMS fabrication include standard semiconductor fabrication processes and emerging micromachining techniques. Among the challenges emerging from the manufacturing of MEMS devices, post-processing seems to be one of the most sensitive issues. The non-traditional common post-processing techniques are bulk micromachining and surface micromachining. It has been a challenge for MEMS designers to develop a micromachining technique that is compatible with IC (Integrated Circuits) processes and also capable of making MEMS structures through both bulk and surface micromachining with acceptable surface roughness requirements. The selected micromachining process should not affect the integrity of the free standing structure due to the reduced selectivity and aggressive etch of the adjacent electronic circuitry. Moreover, the integrity of the released structure, the dynamic properties as well as the electrostatic characteristics, are strongly dependent on the achieved roughness of the surfaces produced by the etching process. Hence, this paper presents the surface roughness characterisation of gas phase micromachining with XeF2that is suitable for fabricating integrated MEMS with both micromechanical and microelectronics components. This paper also presents some fabricated microsystems using this process. Copyright {\circledC} 2005 Inderscience Enterprises Ltd.",
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