Electro-thermal considerations dedicated to 3D integration; noise coupling

Yue Ma, Olivier Valorge, J. R. Cárdenas-Valdez, J. C. Núñez-Perez, J. Verdier, Francis Calmon, Christian Gontrand

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

© 2018 by Taylor & Francis Group, LLC. 3D integration is considered the most promising solution to overcome current challenges in planar technologies. As an emerging technology, electrical compact models are notably required for 3D interconnects, including Through-Silicon Via (TSV), to accurate 3D-system performances. More generally, analytical substrate extraction methods, relying on the Transmission Line Matrix (TLM) method, or the use of Green kernels, are proposed to model multilayers substrates on an electrical, but also thermal, points of view. An important problem for designers of complex heterogeneous circuits, combining digital and analog parts, is also to predict the perturbations coming from commutating logical gates, flowing through the substrate to reach some sensitive analog blocks. We then present, in this paper, an application of a stochastic model based on Markovian processes; the digital switching activity is modeled as functions defined as Markov Chains. The final goal is to grasp the noise power density of such perturbations. As an example, we extract an actual interference signal resulting from the modulation of parasitic injected waveforms for instance into some circuit supply driven by the discrete stochastic process.
Original languageAmerican English
Title of host publicationNoise Coupling in System-on-Chip
Number of pages396
ISBN (Electronic)9781138031616, 9781498796774
DOIs
StatePublished - 1 Jan 2018

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Substrates
Digital circuits
Signal interference
Stochastic models
Random processes
Markov processes
Electric lines
Multilayers
Modulation
Silicon
Networks (circuits)
Hot Temperature

Cite this

Ma, Y., Valorge, O., Cárdenas-Valdez, J. R., Núñez-Perez, J. C., Verdier, J., Calmon, F., & Gontrand, C. (2018). Electro-thermal considerations dedicated to 3D integration; noise coupling. In Noise Coupling in System-on-Chip https://doi.org/10.1201/9781315116693
Ma, Yue ; Valorge, Olivier ; Cárdenas-Valdez, J. R. ; Núñez-Perez, J. C. ; Verdier, J. ; Calmon, Francis ; Gontrand, Christian. / Electro-thermal considerations dedicated to 3D integration; noise coupling. Noise Coupling in System-on-Chip. 2018.
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Ma, Y, Valorge, O, Cárdenas-Valdez, JR, Núñez-Perez, JC, Verdier, J, Calmon, F & Gontrand, C 2018, Electro-thermal considerations dedicated to 3D integration; noise coupling. in Noise Coupling in System-on-Chip. https://doi.org/10.1201/9781315116693

Electro-thermal considerations dedicated to 3D integration; noise coupling. / Ma, Yue; Valorge, Olivier; Cárdenas-Valdez, J. R.; Núñez-Perez, J. C.; Verdier, J.; Calmon, Francis; Gontrand, Christian.

Noise Coupling in System-on-Chip. 2018.

Research output: Chapter in Book/Report/Conference proceedingChapter

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Ma Y, Valorge O, Cárdenas-Valdez JR, Núñez-Perez JC, Verdier J, Calmon F et al. Electro-thermal considerations dedicated to 3D integration; noise coupling. In Noise Coupling in System-on-Chip. 2018 https://doi.org/10.1201/9781315116693